United States Is the Largest Through Glass Via (TGV) Wafer Market With about 46% Market Share

According to our (Global Info Research) latest study, the global Through Glass Via (TGV) Wafer market size was valued at US$ 105 million in 2024 and is forecast to a readjusted size of USD 880 million by 2031 with a CAGR of 35.8% during review period.

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.

On 2025-2-10 Global Info Research released【Global Through Glass Via (TGV) Wafer Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031】. This report includes an overview of the development of the Through Glass Via (TGV) Wafer industry chain, the market status of Consumer Electronics (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), Household Appliances (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Through Glass Via (TGV) Wafer.

Sample Report Request Through Glass Via (TGV) Wafer
https://www.globalinforesearch.com/reports/2412681/through-glass-via--tgv--wafer

According to our (Global Info Research) latest study, the global Through Glass Via (TGV) Wafer market size was valued at US$ 105 million in 2024 and is forecast to a readjusted size of USD 880 million by 2031 with a CAGR of 35.8% during review period.

Market segment by Type：300 mm、200 mm、Below150 mm
Market segment by Application：Biotechnology/Medical、Consumer Electronics、Automotive、Others
Major players covered： Corning、LPKF、Samtec、Kiso Micro Co.LTD、Tecnisco、Microplex、Plan Optik、NSG Group、Allvia

Table of Contents

1 Market Overview
1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Classification of Through Glass Via (TGV) Wafer by Type
1.3.1 Overview: Global Through Glass Via (TGV) Wafer Market Size by Type: 2020 Versus 2024 Versus 2031
1.3.2 Global Through Glass Via (TGV) Wafer Consumption Value Market Share by Type in 2024
1.3.3 300 mm
1.3.4 200 mm
1.3.5 Below150 mm
1.4 Global Through Glass Via (TGV) Wafer Market by Application
1.4.1 Overview: Global Through Glass Via (TGV) Wafer Market Size by Application: 2020 Versus 2024 Versus 2031
1.4.2 Biotechnology/Medical
1.4.3 Consumer Electronics
1.4.4 Automotive
1.4.5 Others
1.5 Global Through Glass Via (TGV) Wafer Market Size & Forecast
1.6 Global Through Glass Via (TGV) Wafer Market Size and Forecast by Region
1.6.1 Global Through Glass Via (TGV) Wafer Market Size by Region: 2020 VS 2024 VS 2031
1.6.2 Global Through Glass Via (TGV) Wafer Market Size by Region, (2020-2031)
1.6.3 North America Through Glass Via (TGV) Wafer Market Size and Prospect (2020-2031)
1.6.4 Europe Through Glass Via (TGV) Wafer Market Size and Prospect (2020-2031)
1.6.5 Asia-Pacific Through Glass Via (TGV) Wafer Market Size and Prospect (2020-2031)
1.6.6 South America Through Glass Via (TGV) Wafer Market Size and Prospect (2020-2031)
1.6.7 Middle East & Africa Through Glass Via (TGV) Wafer Market Size and Prospect (2020-2031)
2 Company Profiles
2.1 Corning
2.1.1 Corning Details
2.1.2 Corning Major Business
2.1.3 Corning Through Glass Via (TGV) Wafer Product and Solutions
2.1.4 Corning Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.1.5 Corning Recent Developments and Future Plans
2.2 LPKF
2.2.1 LPKF Details
2.2.2 LPKF Major Business
2.2.3 LPKF Through Glass Via (TGV) Wafer Product and Solutions
2.2.4 LPKF Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.2.5 LPKF Recent Developments and Future Plans
2.3 Samtec
2.3.1 Samtec Details
2.3.2 Samtec Major Business
2.3.3 Samtec Through Glass Via (TGV) Wafer Product and Solutions
2.3.4 Samtec Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.3.5 Samtec Recent Developments and Future Plans
2.4 Kiso Micro Co.LTD
2.4.1 Kiso Micro Co.LTD Details
2.4.2 Kiso Micro Co.LTD Major Business
2.4.3 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Product and Solutions
2.4.4 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.4.5 Kiso Micro Co.LTD Recent Developments and Future Plans
2.5 Tecnisco
2.5.1 Tecnisco Details
2.5.2 Tecnisco Major Business
2.5.3 Tecnisco Through Glass Via (TGV) Wafer Product and Solutions
2.5.4 Tecnisco Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.5.5 Tecnisco Recent Developments and Future Plans
2.6 Microplex
2.6.1 Microplex Details
2.6.2 Microplex Major Business
2.6.3 Microplex Through Glass Via (TGV) Wafer Product and Solutions
2.6.4 Microplex Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.6.5 Microplex Recent Developments and Future Plans
2.7 Plan Optik
2.7.1 Plan Optik Details
2.7.2 Plan Optik Major Business
2.7.3 Plan Optik Through Glass Via (TGV) Wafer Product and Solutions
2.7.4 Plan Optik Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.7.5 Plan Optik Recent Developments and Future Plans
2.8 NSG Group
2.8.1 NSG Group Details
2.8.2 NSG Group Major Business
2.8.3 NSG Group Through Glass Via (TGV) Wafer Product and Solutions
2.8.4 NSG Group Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.8.5 NSG Group Recent Developments and Future Plans
2.9 Allvia
2.9.1 Allvia Details
2.9.2 Allvia Major Business
2.9.3 Allvia Through Glass Via (TGV) Wafer Product and Solutions
2.9.4 Allvia Through Glass Via (TGV) Wafer Revenue, Gross Margin and Market Share (2020-2025)
2.9.5 Allvia Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global Through Glass Via (TGV) Wafer Revenue and Share by Players (2020-2025)
3.2 Market Share Analysis (2024)
3.2.1 Market Share of Through Glass Via (TGV) Wafer by Company Revenue
3.2.2 Top 3 Through Glass Via (TGV) Wafer Players Market Share in 2024
3.2.3 Top 6 Through Glass Via (TGV) Wafer Players Market Share in 2024
3.3 Through Glass Via (TGV) Wafer Market: Overall Company Footprint Analysis
3.3.1 Through Glass Via (TGV) Wafer Market: Region Footprint
3.3.2 Through Glass Via (TGV) Wafer Market: Company Product Type Footprint
3.3.3 Through Glass Via (TGV) Wafer Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global Through Glass Via (TGV) Wafer Consumption Value and Market Share by Type (2020-2025)
4.2 Global Through Glass Via (TGV) Wafer Market Forecast by Type (2026-2031)
5 Market Size Segment by Application
5.1 Global Through Glass Via (TGV) Wafer Consumption Value Market Share by Application (2020-2025)
5.2 Global Through Glass Via (TGV) Wafer Market Forecast by Application (2026-2031)
6 North America
6.1 North America Through Glass Via (TGV) Wafer Consumption Value by Type (2020-2031)
6.2 North America Through Glass Via (TGV) Wafer Market Size by Application (2020-2031)
6.3 North America Through Glass Via (TGV) Wafer Market Size by Country
6.3.1 North America Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
6.3.2 United States Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
6.3.3 Canada Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
6.3.4 Mexico Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
7 Europe
7.1 Europe Through Glass Via (TGV) Wafer Consumption Value by Type (2020-2031)
7.2 Europe Through Glass Via (TGV) Wafer Consumption Value by Application (2020-2031)
7.3 Europe Through Glass Via (TGV) Wafer Market Size by Country
7.3.1 Europe Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
7.3.2 Germany Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
7.3.3 France Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
7.3.4 United Kingdom Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
7.3.5 Russia Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
7.3.6 Italy Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
8 Asia-Pacific
8.1 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Type (2020-2031)
8.2 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Application (2020-2031)
8.3 Asia-Pacific Through Glass Via (TGV) Wafer Market Size by Region
8.3.1 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Region (2020-2031)
8.3.2 China Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
8.3.3 Japan Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
8.3.4 South Korea Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
8.3.5 India Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
8.3.6 Southeast Asia Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
8.3.7 Australia Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
9 South America
9.1 South America Through Glass Via (TGV) Wafer Consumption Value by Type (2020-2031)
9.2 South America Through Glass Via (TGV) Wafer Consumption Value by Application (2020-2031)
9.3 South America Through Glass Via (TGV) Wafer Market Size by Country
9.3.1 South America Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
9.3.2 Brazil Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
9.3.3 Argentina Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
10 Middle East & Africa
10.1 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Type (2020-2031)
10.2 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Application (2020-2031)
10.3 Middle East & Africa Through Glass Via (TGV) Wafer Market Size by Country
10.3.1 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
10.3.2 Turkey Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
10.3.3 Saudi Arabia Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
10.3.4 UAE Through Glass Via (TGV) Wafer Market Size and Forecast (2020-2031)
11 Market Dynamics
11.1 Through Glass Via (TGV) Wafer Market Drivers
11.2 Through Glass Via (TGV) Wafer Market Restraints
11.3 Through Glass Via (TGV) Wafer Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 Through Glass Via (TGV) Wafer Industry Chain
12.2 Through Glass Via (TGV) Wafer Upstream Analysis
12.3 Through Glass Via (TGV) Wafer Midstream Analysis
12.4 Through Glass Via (TGV) Wafer Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer

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