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6 REPRESENTATIVE RIGID-FLEX BOARD CONSTRUCTIONS

2021-12-23 15:18:42 | 日記

Applications of Rigid-Flex boards can be found throughout the electronics industry and in the most demanding applications including industrial control, medical and military.

Rigid-Flex PCB design has evolved significantly over the past decade. Modern designs require the rigid areas to be fully capable “rigid” boards. The same limits of complexity and density are pushed as in modern PCB’s including: fine lines/spacing, high aspect ratio vias, blind and buried gsm alarm system vias, high layer counts, higher operating temperatures, and RoHS assembly compliance.

As a PCB manufacturer, MAD PCB manufactures single-, double-, and multi-layered flexible printed circuits using modern rigid-flex materials and construction. Designs comply with IPC-2223 standards, which define the elimination/minimization of adhesive use within rigid areas, use of adhesiveless FCCL, and use of selective or partial coverlay construction.

In Gerber reviewing and quote stage, rigid-flex board’ specifications, materials, and construction are carefully examined in order to minimize and eliminate any technical issues. Areas of opportunity for improved reliability, functionality, and cost reductions are also identified to generate an accurate quote that is based on a manufacturable, reliable and cost-effective design.

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GLOSSY OR MATTE SOLDER MASK ON PCBS

2021-12-23 15:15:15 | 日記

Glossy vs. Matte Finish
 

Glossy Solder Mask: A glossy finish for a PCB is a light-reflective solder mask lighter in color than a matte PCB finish. It has a poreless appearance as opposed to the softer look of a matt finish.

Matte Solder Mask: Matte finishes for PCB solder masks have no shine and tend to appear darker than glossy finishes. They have soft, porous appearance that does not reflect light.

 

There are no different requirements between the two solder mask finish types when discussing solder mask standards. Information on their use is contained in the latest IPC-SM-840E Qualification and Performance of Permanent Solder Mask. The specification is intended to the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system, and to enable the designer, fabricator, and user to collectively qualify a circuit board fabrication process. No matter glossy or matte solder mask, it will not affect board function in any way.

 

Benefits of a Glossy Finish
 

Many of the benefits of a solder mask finish depend on the designer’s aesthetic preferences. You might choose a glossy finish over a matte solder mask on your printed circuit boards due to:

 

Aesthetic Value: because PCB fabricators likely default to glossy finish choice for solder mask, many designers consider them the classic PCB appearance. Their shine gives them what perceive as a more modern look.
Appearance of Wear: The reflective properties of a glossy finish tend to make signs of wear look less prominent.
Scratch Resistance: Because of glossy finish’s harder surface, a gloss finish has higher scratch resistance than a matte finish in board fabrication and PCB assembly manufacturing.
 

Benefits of a Matte Finish
 

Your preference in PCB appearance will also determine whether you’ll want a matte finish instead of a glossy solder mask. A matte finish may make some aspects of fabrication easier. However, an experienced PCB fabricator will provide quality results regardless of solder mask finish. The benefits of a matte finish include:

 

Visibility during Inspection: A matte finish does not have shine under any lighting used during inspection. As a result, you can move easily see the appearance details of the boards and board assemblies.
Problem Detection: Matte finishes make problems more RC airplane   evident than glossy finishes. During inspection, it becomes easier to detect issues on a matte finish due to increased visibility.
Solder Ball Reduction: Research suggests that matte finishes reduce a board’s risk of solder ball information. Data indicates that a lower glossy level on PCBs results in lower solder ball levels.
 

Reasons to Choose a Glossy Finish but Not a Matte Finish?
 

The main difference between a glossy finish and a matte finish is an aesthetic one, and many people feel that a glossy finish simply looks better. Glossy solder masks are shiny. They reflect light and look lighter, while matte finishes are dull and dark. Glossy solder mask has a harden shell finish while a matte finish is softer looking.

 

Matte finishes may also scratch more easily and show residue or surface cosmetics better, although scratches on a gloss finish will show more. If you expect the look of your PCB will have a positive effect on your PCB assembly manufacturers or anyone who may end up looking at them, you may want to print with glossy finish. Just keep in mind the high light reflectivity can be nuisance to vision during assembly in some cases.

 

As a PCB designer or buyer, you may want to choose a glossy finish over a matter finish when:

 

Appearance Matters for Your PCB: In applications where appearance impacts your product marketing, a glossy finish can help by increasing aesthetic appeal.
You have No Specific Preference: If you don’t have a particular finish preference, remember that glossy finishes serve as the industry default for most PCB suppliers.
 

Why Choose a Matte Finish but Not a Glossy Finish?
 

Although it is no more cost-effective or efficient to choose a matte finish over a glossy one, there is QX Motor  one consideration that may cause some to prefer the matte finish, and it involves Tin Solder Balls. If you are concerned that solder balls may be a problem for you, you may be inclined to choose a matte finish. This is because, while there are several factors that contribute to solder balls, one is the level of surface roughness. The smoother the surface, the more likely it is that solder will ball up.

 

The theory behind this is that molten solder behaves differently on rough FMS RC Jet   surface and smooth surfaces. On rough surfaces, it tends to form a convex shape, reducing the area solder balls can attach to, while on smooth, hard shell of the glossy finish, many PCB experts feel that a matte finish will result in fewer solder balls. With all of this said, glossy finishes are used all the time on boards, so you may not find this to be a particular problem.

 

When you’re considering your choice of solder mask finish, you might prefer a matte option in these situations:

 

You want to streamline production as much as possible: When you consider production accuracy a top priority, a matte finish may give you more peace of mind during board fabrication. However, skilled PCB fabricators should detect errors in either finish type.
Participation in quality assurance matters to you: If you plan to inspect your PCB yourself after PCB production, a matte finish can help with the process. It shows errors more clearly for you to provide accurate feedback to your PCB fabricator.


9 TIPS TO SAVE YOUR PCB COST for PCBA manufacturer

2021-12-23 15:12:06 | 日記

How to Save Your PCB Cost? 9 Tips All You Want to Know
Fabricating low PCB cost is not easy, and there is a boat load of machinery, human labor, and processes that make it all happen. But your list of concerns is probably different and involving getting your board back in a timely manner while saving some money in the process. That’s why MADPCB is here, to help you avoid any of the unnecessary complexity and errors in your PCB design that can take a huge amount out of your wallet come PCB manufacturing time. So, without further ado, here’s 10 practical tips that we put together that are guaranteed to save you money on your next trip to the fab house.

 

Tip 1 – Keep Your PCB Size at a Minimum

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While this one might be the most obvious, it’s also the one factor that can take a huge chunk out of your wallet. Always try to keep your completed board size to a minimum, as the bigger it gets, so do your costs. This also works the other way around. If you make your board too small, a PCB manufacturer will need very precise equipment to put everything put together, which will also cost more. So, at the end of the day it’s a balancing act for you to navigate between size and complexity, but try to err on the side of less is more.

 

Tip 2 – Don’t Skimp on Quality Materials
 

Before you go and tell your manufacturer to use one of those cheaper, substitute materials for your layer stack, hear us out. Think about when you get that board back, what if it fails within days, weeks, or months after you power it up?

If you skimp on materials now, you’ll probably wind up losing more money in the long run when you find that your boards are glorified coffee coasters. So, when it comes to selecting materials for your layer stack, use the standard, quality stuff, it’s there for a reason.

 

Tip 3 – Stick with Standard Board Shapes
 

Unless you have a crazy looking enclosure to fit your design in, always design your board in the standard square and rectangular shapes characteristic of most PCBs. Doing anything out of the norm will skyrocket your manufacturing costs significantly. Also, don’t’ bother adding any internal cutouts to your PCB unless you need it to mount to an enclosure. Keep it simple!

 

Tip 4 – Stay Within Your Minimum Spacing Requirements
 

This one works just the opposite of your board size. As the spacing between your copper objects like pads and tracks decreases, the more your manufacturing costs will increase. The reasoning behind this is fairly simple, the more stuff you pack into a smaller package, the more precise the manufacturing machinery will need to be. Many fab houses have a standard set of spacing requirements, which is somewhere around 8-10 mils minimum spacing between pads, tracks and track widths.

Always check with your manufacturer to see their specific spacing requirements. And save yourself from some added worry about adding design rules in your PCB design software for these spacing requirements so you don’t need to think about it while you design.

 

Tip 5 – Use the Biggest Diameter Possible for Holes
 

The smaller your holes and annular rings, the higher your manufacturing costs will climb. Again, it comes down to smaller spacing needing precise machinery. Many fab houses will even charge extra if you need holes that are smaller than 0.4mm, so be sure to give your manufacturer a call to avoid any unnecessary costs.

 

Tip 6 – Use the Right Via for the Design
 

There are three types of vias – through-hole vias, blind and buried vias. The last two are only going to be used for high density and high frequency PCBs. So, this one is simple, if your design doesn’t need these types of vias, leave them out to avoid any extra manufacturing costs. For simple designs, stick with the through-hole via for easy manufacturing.

 

Tip 7 – Chill Out on the Extra Layers
 

Before you go adding a bunch of additional layers for more routing space, power planes, or performance, think again. The difference between a four-layer board and a two-layer board is double! On your next design, keep things clean and compact and only use as many RC plane motor  layers as needed to get the job done. Even if that means a little more in board size.

 

Tip 8 – Set Your PCB Design Up for Panelization
 

At a fab house, PCBs are made on a giant panel with a bunch of other PCBs, or just yours depending on how many you ordered. You can save yourself a ton of money at this point by using the largest panel size available from your manufacturer. Getting all of your boards on one panel means that rapid-fire pick and place machine IP camera   can get all your parts placed in one go without requiring any additional setup time.

 

Tip 9 – Use Only Industry Standard Sizes and Components
 

There’s a reason why the electronics industry uses a standardized set of sizes and components – it makes everyone’s job easier and more efficient. It also adds some potential for automation in all of those high-tech pieces of manufacturing equipment. So, to avoid any wasted money required from having your manufacturer assemble your weird components by hand, be sure to stick with the industry standard specifications, which may differ between each fab house.

Last but not least, unless you’re building a mega complex design then it’s best to stick with standard surface mount components (also called Surface Mount Devices, or SMDs). Why? A few reasons:

Using surface mount components will reduce the quantity of holes that need to be drilled on your board that are typically used for through-hole components.
This will also reduce the number of processes required to get all of your parts soldered onto your board. kerui gsm alarm  
You will likely get your board back in less time, as through-hole components require hand assembly by a certified person.


PCB DFM Service

2021-12-23 15:08:44 | 日記

There are a lot of steps and processes going on during printed circuit board (PCB) manufacturing, and your contract manufacturer wants to make sure ahead of time that your PCB board won’t have any design for manufacturability (DFM) issues that could cause problems, like costly halts in production and wasted runs. PCB DFM checks can be performed by the PCB manufacturer to ensure your PCB is manufactured correctly, and improve your product’s reliability.

As a value-added service contributing to our PCB fabrication and assembly services, MADPCB provides free DFM check, also known as free DFM. PCB designers tend to know little about manufacturing and some points described in design file may not be totally compatible with manufacturing requirements. In DFM check process, our CAM engineer checks your original Gerber files for possible DFM issues. If any issues found, we will contact you immediately to give you modification suggestions. When the DFM issues solved, the boards will be put into fabrication through the PCB manufacturing process.

 

5 DFM Check Aspects
 

PCB DFM check is the first step in manufacturing your printed circuit boards (PCBs). As a PCB manufacturer, MADPCB always performs DFM check on 5 aspects, including Hole Checks, Signal and Mixed Layer Checks, Power or Ground Layer Checks, Solder Mask Checks, Silkscreen Checks. These DFM checks are based on design rules and manufacturing capabilities. You can go through the following for details of each DFM check aspect. Arrows RC Jet 

 

Hole Checks
The hole checks process is intended to find potential manufacturability defects in drill layers, including NPTHs and PTHs (thru via, buried and blind via layers) and create.

Drill Checks Purpose
Hole Size Provides a list of all PTHs, NPTHs & vias, all NPTHs that need 1st drills.
Hole Separation Reports duplicated holes, touching holes and close holes.
Missing Holes Reports missing drills for non-SMD (solder mask defined) pads
Extra Holes Reports redundant drills that do not belong to any pads.
Power /Ground Shorts Reports drills touching large copper nets of more than one power or ground layer.
NPTH to Route Reports drills that have the tooling hole or mounting hole attributes, and NPTHs that are close to the route path.
Stubbed Vias Reports cases of vias not connected to at least two copper layers.
Thermal Connection Reports the absence of thermals for thru-hole pin drills and calculates the total copper area of thermal connections through all negative power, ground and mixed layers.
 

Signal and Mixed Layer Checks
 

In DFM checks, signal and mixed layer checks is intended to find potential manufacturability defects in signal layers and mixed layers and generate statistics. The action can operate on any layer, but is mainly intended for signal layers. It uses the layer itself and any NC (drill or route) layer which pierces it. The main checklist displayed in below table.

 

Signal and Mixed Layer Checks Purposes
Spacing Reports spacing violations between pads, circuits and nets, and between text to text, also shorts and spacing between different CAD nets &close distances between non-touching features on the same CAD or layer nets.
Drill Reports distance violations between NPTHs/PTHs/Vias, and pads, circuits, annular rings and copper. Also reports missing pads.
Route Reports distance violations between edge of route features and pads, circuits, etc.
Size Reports size of pads, shaved lines, text, line neckdowns, arcs and shaved arcs.
Silver Reports on silvers between lines and pads & between pads and pads. Silvers between a text feature & a functional pad will be reported, while silver between two features with the copper text attribute will be ignored.
Stubs Reports unconnected line endpoints.
 

Power /Ground Checks
 

Power /Ground Checks are intended to find potential manufacturability defects in power, ground and mixed layers. It uses different algorithms to diagnose negative and positive power and ground layers. The main checklist is displayed in following table.

 

Power /Ground Checks Purposes
Drill Reports distance violation between NTPHs/PTHs/Vias to plane, copper, clearance and annular rings.
Silver Reports silvers in negative and positive layers. GSM alarm system 
Route Reports close spacing between copper/clearance and route features.
Thermal Reports spoke (tie) widths and reducing of connectivity of thermal pads.
NFP Spacing Reports spacing between NFPs (non-functional pads) and NFPs, NTPs and planes.
Plane Spacing Reports spacing between features of different planes.
Keepin/Keepout Areas Reports features inside or outside Keein or Keepout areas.
Plane Width Reports insufficient width of copper between 2 drills connected to a copper plane.
Plane Connection Reports disconnected areas of copper often used as reference planes that are left in a design could cause an unreferenced net, or a missing electrical connection.
 

Solder Mask Checks
 

Solder mask checks are intended to check solder mask layers for potential manufacturability defects. Solder mask layers are always assumed to be negative, that is, all positive features describe clearance or the absence of solder masks. This action also checks if solder paste has been deposited on all SMD pads. The action operates on a single solder mask layer per side at a time. If more that one SMD is selected, the action will not work. The main checklist is displayed in the following table.

 

Solder Mask Checks Purposes
Drill Reports close distance to solder mask openings of PTH/NPTH annular rings, and where NPTH touches mask.
Pads Reports close distance to solder mask openings of all pads, including undrilled pads. It also reports on a special group, gaskets, which reports the width of solder mask overlap on features.
Coverage Reports lines too close to clearance (that is, not adequately covered).
Route Reports close distance between solder mask brushless  motor and route features.
Bridge Reports close distance between solder mask and route features.
Silver Reports silvers between solder mask clearance.
Missing Reports missing clearances.
Spacing Reports close spacing between clearance (wider than silver).
Extra Reports solder mask features which lack copper pads, or do not intersect with copper.
 

Silkscreen Checks
 

Silkscreen checks are intended to find potential manufacturing defects in silkscreen layers and generate statistics. The check operates only on silkscreen layers as it relied on the job matrix to find related external copper, solder mask and drill layers against which to check. IP camera The main checklist is displayed in this table.