1. Semiconductor, as it literally seems to be, is a solid substance whose conductivity is between insulator and most metals, either due to the addition of an impurity or because of temperature effects. In other words, the conductivity of the semiconductor can be controlled by adding impurities as a specific amount of other materials to the semiconductor.
2.Most semiconductor wafers are made of silicon, which is the second-most abundant element in the Earth's crust (about 28% by mass) after oxygen and the eighth-most common element in the entire universe by mass. In addition to silicon, semiconductors also use other materials, including germanium, gallium arsenide, germanium, indium phosphide, sapphire and quartz.
3. Semiconductor wafers are available in a spread of diameters. The first semiconductor wafer made inside the US in 1960 was just 1 inch in diameter. Today, standard semiconductor wafers go up to 12 inches to 18 inches.
4. Sputtering target is an importanced material for semiconductor coating. Usually, semiconductors have the highest technical requirements and purity requirements, which are significantly higher than other applications such as flat panel displays and solar cells. Thus, the price of high quality sputtering target used for semiconductor is also the most expensive.
5. Water is the key component of manufacturing Silicon wafers. It is a compound that basically is a general solvent for all substances, silicon included. A large production facility uses up to 4.8 million of gallons of water everyday to supply Silicon wafers for manufacturing needs and supply.
6. The thickness of semiconductor wafers vary greatly. The thickness of wafer is always determined by the mechanical strength of any material used to make it. Regardless of what the semiconductor is made of, the wafer must be thick enough to support its own weight so that it does not break during processing.
7. Contamination is inevitable during the manufacture and transportation of semiconductors. Appropriate storage conditions must be in place to prevent contamination and/or degradation after shipment. Semiconductor wafers that are not vacuum sealed must be placed in a Nitrogen (N2) cabinet at a flow rate of 2 to 6 SCFH (Standard Cubic Feet per Hour).
Please visit https://www.sputtertargets.net/ for more information.
2.Most semiconductor wafers are made of silicon, which is the second-most abundant element in the Earth's crust (about 28% by mass) after oxygen and the eighth-most common element in the entire universe by mass. In addition to silicon, semiconductors also use other materials, including germanium, gallium arsenide, germanium, indium phosphide, sapphire and quartz.
3. Semiconductor wafers are available in a spread of diameters. The first semiconductor wafer made inside the US in 1960 was just 1 inch in diameter. Today, standard semiconductor wafers go up to 12 inches to 18 inches.
4. Sputtering target is an importanced material for semiconductor coating. Usually, semiconductors have the highest technical requirements and purity requirements, which are significantly higher than other applications such as flat panel displays and solar cells. Thus, the price of high quality sputtering target used for semiconductor is also the most expensive.
5. Water is the key component of manufacturing Silicon wafers. It is a compound that basically is a general solvent for all substances, silicon included. A large production facility uses up to 4.8 million of gallons of water everyday to supply Silicon wafers for manufacturing needs and supply.
6. The thickness of semiconductor wafers vary greatly. The thickness of wafer is always determined by the mechanical strength of any material used to make it. Regardless of what the semiconductor is made of, the wafer must be thick enough to support its own weight so that it does not break during processing.
7. Contamination is inevitable during the manufacture and transportation of semiconductors. Appropriate storage conditions must be in place to prevent contamination and/or degradation after shipment. Semiconductor wafers that are not vacuum sealed must be placed in a Nitrogen (N2) cabinet at a flow rate of 2 to 6 SCFH (Standard Cubic Feet per Hour).
Please visit https://www.sputtertargets.net/ for more information.
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