の反対側に配置

Me: Translate the following sentence into English. The sentence pertains to an application for patent for an electrical device. 基板の下面に支持体が配置されている。支持体の基板と反対側に、絶縁体が配置されている。

 

ChatGPT

A support is positioned on the underside of the substrate. An insulator is positioned on the side of the support opposite the substrate.

Me: As regards the second sentence, how about "An insulator is positioned on the opposite side of the support from the substrate"? Is this acceptable?

 

ChatGPT

Yes, "An insulator is positioned on the opposite side of the support from the substrate" is an acceptable and clear translation for the second sentence.

Me: Still referring to the same arrangement of the substrate, support, and insulator, translate the following into English. 支持体の絶縁体が配置されている側に配線層が配置されている。

 

ChatGPT

A wiring layer is positioned on the side of the support where the insulator is located.

Me: Is it the same as "A wiring layer is positioned on the side of the support on which the insulator is located."?

 

ChatGPT

Yes, "A wiring layer is positioned on the side of the support on which the insulator is located." conveys the same meaning and is also a correct translation.

Me: What difference do "where" and "on which" make?

 

ChatGPT

The difference between using "where" and "on which" in these sentences is subtle and mostly stylistic:

1. "Where": This word often suggests a location or place more naturally and informally.

   • "A wiring layer is positioned on the side of the support where the insulator is located."
   • This sentence flows slightly more smoothly in everyday language and is easier to read.

2. "On which": This phrase is more formal and precise, often used in technical or legal contexts.

   • "A wiring layer is positioned on the side of the support on which the insulator is located."
   • This construction emphasizes the specific relationship between the objects and can be clearer in technical writing.

In summary, "where" is more conversational and fluid, while "on which" is more formal and precise. Both are correct and convey the same meaning, so the choice depends on the context and the desired tone.

補足の必要性

Me: In technical writing, particularly when drafting patent applications for electrical inventions, which of the following two sentences is better in terms of grammar, clarity, common usage, and so on? 1) The switch is moveable between a first position of being in contact with a terminal and a second position of being out of contact with the terminal. 2) The switch is moveable between a first position in which the switch is in contact with a terminal and a second position in which the switch is out of contact with the terminal.

 

ChatGPT

In technical writing for patent applications, clarity and precision are paramount. Between the two sentences provided, the second one is better in terms of grammar, clarity, and common usage. Here's why:

Sentence Analysis

1. Original Sentence 1:
   • "The switch is moveable between a first position of being in contact with a terminal and a second position of being out of contact with the terminal."
2. Original Sentence 2:
   • "The switch is moveable between a first position in which the switch is in contact with a terminal and a second position in which the switch is out of contact with the terminal."

Grammar and Clarity

• Precision and Redundancy:
  • Sentence 2 is more explicit and avoids the awkward construction "a first position of being." It clearly states what the positions are by using "in which," providing a more precise description.
• Common Usage:
  • Sentence 2 uses a structure that is more commonly seen in technical writing and patent language. The repetition of "the switch is" may seem redundant but enhances clarity by removing any ambiguity about what is being described in each position.

Preferred Sentence

The preferred sentence is:

"The switch is moveable between a first position in which the switch is in contact with a terminal and a second position in which the switch is out of contact with the terminal."

Explanation

• Clarity:

  • Using "in which" makes it explicit that the positions are defined by the switch's contact state with the terminal.
  • Repeating "the switch is" removes any potential ambiguity, ensuring the reader understands the exact condition being described in each position.

• Grammar:

  • The sentence is grammatically sound and avoids complex constructs that might confuse the reader.

• Technical Writing Standards:

  • This construction aligns with the standards of technical writing, especially in legal documents like patent applications, where precision is critical.

Therefore, Sentence 2 is better suited for technical writing in patent applications for electrical inventions.

Me: Forget about what we've said so far. Translate the following into English for patent application purposes. このスイッチは端子と接触する第1位置と、端子と接触しない第2位置の間を移動可能である。

 

ChatGPT

For patent application purposes, the translation of the given Japanese sentence into English is:

"This switch is movable between a first position in which it is in contact with a terminal and a second position in which it is not in contact with the terminal."

This translation maintains clarity, precision, and the formal tone appropriate for a patent application.

Me: Referring back to the answer you've given to my initial question, the first sentence may be awkward, but is it still acceptable? Does it convey the fact that it is the switch that is in contact with the terminal at the first position and out of in contact therewith in the second position?

 

ChatGPT

The first sentence is indeed more awkward, but it is still acceptable in the context of technical writing for a patent application. It conveys the essential information that the switch is in contact with the terminal in the first position and out of contact in the second position. However, the sentence could benefit from slight rephrasing for improved clarity while retaining the original structure.

Here's a slightly revised version for clarity:

"The switch is movable between a first position where it is in contact with a terminal and a second position where it is out of contact with the terminal."

This revision maintains the same meaning and makes it clearer that it is the switch that changes its contact state with the terminal in each position.

 

があった場合

WO2014051790(INTEL CORP [US])
In open ProSe Discovery, then discovery can be accomplished without explicit permission from the UE being discovered.
オープンＰｒｏＳｅ検出において、検出は、検出されるＵＥからの明示的な許可がなくても達成され得る。

Restricted ProSe Discovery can take place only with explicit permission from the UE beign discovered. 
限定されたＰｒｏＳｅ検出は、検出されるＵＥからの明示的な許可があった場合にのみ行われ得る。

WO2013048426(INTEL CORP [US])
 Thus on an initial generation of the user profile, it can be stored to this cloud-based location.
このため、ユーザプロファイルを最初に生成するときには、ユーザプロファイルは、クラウドベースのロケーションに格納されてもよい。

Then when any updates occur on a given device, such updates can be communicated to the cloud-based location for storage in this central location. 
次に、任意のデバイスで更新があった場合には、そのような更新は、中枢のロケーションに格納するために、クラウドベースのロケーションに伝達されてもよい。

US9888045(INTEL CORP [US])
[0083] All publications, patents, and patent documents referred to in this document are incorporated by reference herein in their entirety, as though individually incorporated by reference.
【００８３】
  本文書において言及される全ての出版物、特許、および特許文献はその全体が、まるで個別に参照により組み込まれているかのように、本明細書に参照により組み込まれる。

In the event of inconsistent usages between this document and those documents so incorporated by reference,
本明細書とそれら参照により組み込まれる文書との間で矛盾する使用があった場合には、

the usage in the incorporated reference(s) should be considered supplementary to that of this document; for irreconcilable inconsistencies, the usage in this document controls.
組み込まれる参照文献の使用は、本明細書のものの補足であるものとして見なされるべきであり、相容れない矛盾に関しては、本明細書における使用が有効となる。

US9758845(INTEL CORP [US])
[0022] In a second embodiment, the darker the shading in FIG. 3, the higher the concentration of molybdenum and/or tungsten.
【００１６】
  第２の実施形態において、図３の影が濃ければ濃いほど、モリブデン及び／またはタングステンの濃度はより高い。

Thus, in the second embodiment, the concentration of copper in the graded copper alloy conductive route 170 proximate a first surface 172 (adjacent the dielectric material 134 1 ) of the graded copper alloy conductive route 170 may be between about 0% and 10%
従って、第２の実施形態において、傾斜銅合金導電性経路１７０の（誘電材料１３４_１に隣接する）第１面１７２に近接する、傾斜銅合金導電性経路１７０における銅の濃度は、約０％から１０％の間であってよく、

with the remainder, if any, being the alloying metal (i.e. molybdenum and/or tungsten) and co-deposition metal,
残りがあった場合、その残りは、合金化金属（すなわち、モリブデン及び／またはタングステン）及び共堆積金属であり、

and, proximate a second surface 174 of the graded copper alloy conductive route 170 , may be between about 90% and 100% with the remainder being the alloying metal (i.e. molybdenum and/or tungsten) and co-deposition metal.
傾斜銅合金導電性経路１７０の第２面１７４に近接する、傾斜銅合金導電性経路１７０の銅は約９０％から１００％の間であってよく、残りは、合金化金属（すなわち、モリブデン及び／またはタングステン）及び共堆積金属である。

In an electrodeposition embodiment of the second embodiment, the concentration the co-deposition metal (i.e. nickel, cobalt, and/or iron) may be between about trace levels to about 10%.
第２の実施形態の電着実施形態において、共堆積金属（すなわち、ニッケル、コバルト、及び／または鉄）の濃度は、約複数の微量レベルから約１０％の間であってよい。

US9946650(INTEL CORP [US])
 In one embodiment, graphics logic accesses to the cache hierarchy will be translated from virtual to physical addresses if there is a cache miss,
ある実施形態では、キャッシュ・ミスがあった場合、キャッシュ階層へのグラフィック論理のアクセスは仮想アドレスから物理アドレスに変換される。

so that the proper physical address in system memory can be generated.
それにより、システム・メモリ内の適正な物理アドレスが生成できる。

OS標準

US7725703(MICROSOFT CORP [US])
[0059] Typically, a TPM 301 operates in conjunction with a Static Root of Trust Measurement (SRTM) for performing trusted measurements and submitting them to a TPM 301 .
【００４８】
  一般に、ＴＰＭ３０１は、Ｓｔａｔｉｃ  Ｒｏｏｔ  ｏｆ  Ｔｒｕｓｔ  Ｍｅａｓｕｒｅｍｅｎｔ（ＳＲＴＭ）と共に動作し、信頼できる測定を行い、それらをＴＰＭ３０１にサブミットする。

However, other processes for making secure measurements, such as through the use of a DRTM Nexus are available.
しかしながら、ＤＲＴＭ  Ｎｅｘｕｓの使用などを通して安全な測定を行うための他のプロセスも利用可能である。

Embodiments of the invention may use a trusted measurement process such as an SRTM in this manner,
本発明の実施形態は、こうした方法でＳＲＴＭのような信頼できる測定プロセスを用いることができ、

and in this regard the SRTM may be a BIOS standard SRTM used by the various software components (also called processes and RTMs) discussed herein to measure initial disk based boot code. 
この点で、ＳＲＴＭは、初期ディスク・ベースのブート・コードを測定するために、ここで説明される（プロセスおよびＲＴＭとも呼ばれる）種々のソフトウェア・コンポーネントによって用いられるＢＩＯＳ標準ＳＲＴＭとすることができる。

並べて

US2018031757(3M INNOVATIVE PROPERTIES CO [US])
[0095] Each split spreading structure 542 on the structured surface 544 has a high spreading portion 542 a and a low spreading portion 542 b disposed alongside each other. In the figure, the high spreading portions are shown shaded to indicate a roughened surface in comparison to the smoother surface of the low spreading portion 542 b.