で正規化

WO2013112771
"8. The method according to claim 1 wherein the analyzing step comprises: 
(a) normalizing a spectrogram, including a normalized spectrogram, of the data at least once, time over frequency（周波数にわたって時間で正規化）; and (b) normalizing the spectrogram, including a normalized spectrogram, of the same data at least once, frequency over time（時間にわたって周波数で正規化）."

WO2013081706
"8. The fusion antibody for use in claim 1, wherein at least about 100 ug of arylsulfatase A enzyme are delivered to the brain, normalized per 50 kg body weight（50kg体重当たりで正規化）."

US8934859
"The normalization component 60 can be configured to normalize the time-averaged PSD of the digital signal DIG with respect to（に対して正規化）the predetermined baseline PSD 58."

WO2016039839
"18. The computer-readable medium of claim 15, further having instructions thereon which, when executed by one or more processors, perform the following:
normalizing each frequency-domain PUSCH I/Q sample in the plurality of frequency-domain PUSCH I/Q samples, the plurality of frequency-domain PUSCH I/Q samples corresponding to the plurality of PUSCH I/Q symbols, at the eRRH（ｅＲＲＨで正規化）;

performing a lossy frequency-domain compression at the eRRH in which each frequency-domain PUSCH I/Q sample in the plurality of frequency-domain PUSCH I/Q samples is discretized based on the designated number of bits."

WO2015167676
"14. A processor comprising an AWB module, the AWB module comprising logic circuitry to: 
receive color channel values of a raw image data block; 
normalize the color channel values with a white point correction factor（係数で正規化）; 
determine one or more first image chromaticity weight by quantifying a 
disparity among the normalized color channel values; and store to a memory the one or more first image chromaticity weight in association with the raw image data block."

周辺セル

WO2010141568
"1. A method comprising: receiving, by a mobile station attached to a first access network, a control message identifying neighboring cells（周辺セル）of a different wireless technology than the first access network; searching, by the mobile station, for signaling of the identified neighboring cells of the different wireless technology; and in response to not being able to detect the signaling of the identified neighboring cells, the mobile station increasing a time interval between successive searches for the signaling."

積層基板

US2017260625
"1. A multilayer substrate（積層基板）comprising:
a silicon layer having an optically finished surface; and
a chemical vapor deposition (CVD) grown（化学気相蒸着（ＣＶＤ）成長した）diamond layer on the optically finished surface of the silicon layer, wherein

at an interface（の界面において）of the silicon layer and the diamond layer, the optically finished surface of the silicon layer has a surface roughness (Ra)≦100 nm."

US9638944
"1. A method for laminating（積層）substrates to form a laminated assembly, comprising:
positioning a first substrate and a second substrate within a lamination（積層）device having a first cavity at least partially defined by a first side of a flexible member and a second cavity at least partially defined by a second side of the flexible member;
pressurizing the first cavity to a first pressure to move the flexible member into contact with one of the first and second substrate;
depressurizing the first cavity to move the flexible member out of contact with the one of the first and second substrate; and then
pressurizing the second cavity to a second pressure higher than the first pressure to apply air pressure at the second pressure to the first and second substrate to form a laminated assembly;
wherein during the steps of pressurizing the first cavity, depressurizing the first cavity, and pressurizing the second cavity, the first and second substrates remain within the second cavity."

WO2016132273
"11. A semiconductor structure comprising:
a substrate that includes one or more cooling layers, one or more cooling channels, one or more coolant inlets and outlets in fluid communication with the cooling channels, a device layer disposed on the cooling layers that（＊先行詞が直前でない関係代名詞）has one or more connection points and a device layer area, wherein a device layer thermal coefficient of expansion is substantially equal to that of（＊繰り返しを避ける代名詞）the one or more cooling layers;
a plurality of laminate substrates（積層基板）arranged in an array that are disposed on, and electrically attached to, the device layer, wherein a laminate substrate thermal coefficient of expansion differs from that of the device layer, and each laminate substrate is smaller in area than an area of the device layer portion to which it is attached, and each laminate substrate includes sides with gaps between sides of adjacent laminate substrates,
wherein the laminate substrates are not electrically or mechanically connected to each other across the gaps between laminate substrates and the laminate substrates are small enough to substantially prevent warping and unacceptable stress of the device layer, interconnection and cooling layers due to thermal expansion.
12. The structure of claim 11, wherein the laminate substrates comprise one or more of a PC board, a ceramic or glass substrate, and a built-up organic substrate and the device layer is rigidly attached to the cooling layers by（＊手段のby、動作主体ではなく；by means of, usingの方が良いか？）a material with a high thermal conductivity."

WO2015142591
"1. A semiconductor package comprising: 
a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate; 
a laminate substrate（積層基板）with a second set of one or more package pads formed on a face of the laminate substrate; and 
solder balls configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the 2D POG structure is placed face-up on the face of the laminate substrate."