白金族金属系

EP3808816(JP)
[0005] Further, a silicone resin composition having good metal mold release property has been proposed which contains, as essential components, an organopolysiloxane having two or more alkenyl groups in one molecule, an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, a platinum-based metal catalyst, and a release agent such as a fatty acid ester of an erythritol derivative (refer to, for example, Patent Document 2).
【０００５】
  また、１分子中に２個以上のアルケニル基を有するオルガノポリシロキサンと、１分子中に２個以上のケイ素結合水素原子を有するオルガノハイドロジェンポリシロキサンと、白金族金属系触媒と、エリスリトール誘導体の脂肪酸エステル等の離型剤を必須成分とする、良好な金型離型性を有するシリコーン樹脂組成物が提案されている（例えば、特許文献２参照。）。

EP3805317(JP)
4. A method for preparing a heat-conductive silicone composition of any one of 1 to 3, comprising the steps of

mixing components (A), (B), (C) and (D) with a platinum group metal based curing catalyst such that a molar ratio (Si-H/Si-Vi) of Si-H group in component (B) to silicon-bonded alkenyl group in component (A) may range from 2.0 to 9.0,
４．上記（Ａ）、（Ｂ）、（Ｃ）及び（Ｄ）成分と、白金族金属系硬化触媒とを、（Ａ）成分中のケイ素原子に結合したアルケニル基と（Ｂ）成分中のＳｉ－Ｈ基とのモル比（Ｓｉ－Ｈ／Ｓｉ－Ｖｉ）が２．０～９．０となるように混合する工程と、

and heating the mixture at 100 to 180°C for 30 minutes to 4 hours for reacting component (A) with component (B).
得られた混合物を１００～１８０℃で３０分～４時間加熱して、（Ａ）成分と（Ｂ）成分とを反応させる

工程を含む、１～３のいずれかに記載の熱伝導性シリコーン組成物を製造する製造方法。

EP3790038(JP)
[0037] The polysiloxane (A1) contains the polyorganosiloxane (a1) and the polyorganosiloxane (a2).
【００２１】
  ポリシロキサン（Ａ１）はポリオルガノシロキサン（ａ１）とポリオルガノシロキサン（ａ２）を含む。

The polyorganosiloxane (a1) contains a C1-10 alkyl group and a C2-10 alkenyl group, and the polyorganosiloxane (a2) contains a C1-10 alkyl group and a hydrogen atom.
ポリオルガノシロキサン（ａ１）が炭素原子数１～１０のアルキル基と炭素原子数２～１０のアルケニル基を含んでいて、ポリオルガノシロキサン（ａ２）が炭素原子数１～１０のアルキル基と水素原子を含んでいる。

The alkenyl group and the Si-H group are subjected to a hydrosilylation reaction using the platinum group metal-based catalyst (A2) to form a crosslinking structure, resulting in curing.
アルケニル基とＳｉ－Ｈ基が白金族金属系触媒（Ａ２）によりヒドロシリル化反応によって架橋構造を形成し硬化する。

整流、流体

US2012058527
[0040] The valve plate 16 defines a plurality of commutating passages 118.
【００２８】
  バルブプレート１６は、複数の整流通路１１８を形成する。

The number of commutating passages 118 is equal to the number of volume chambers 64 in the displacement assembly 14. In the depicted embodiment, the number of commutating passages 118 is equal to nine.
この整流通路１１８の数は、変位アセンブリ１４の容積室６４の数に等しい。図示された実施形態において、整流通路１１８の数は、９つである。

The commutating passages 118 extend through the valve surface 114 and the ring surface 116 of the valve plate 16.
整流通路１１８は、バルブプレート１６のバルブ面１１４及びリング面１１６を通って延びている。

Each of the commutating passages 118 includes a valve opening 120 at the valve surface 114 and a volume chamber opening 122 at the ring surface 116.
整流通路１１８のそれぞれは、バルブ面１１４のバルブ開口部１２０、及び、リング面１１６の容積室開口部１２２を含む。

In the depicted embodiment, the commutating passages 118 are aligned with the volume chambers 64 of the displacement assembly 14 when the valve plate 16 is disposed in the fluid device 10.
図示された実施形態において、整流通路１１８は、バルブプレート１６が流体装置１０に配置されたとき、変位アセンブリ１４の容積室６４に整合される。

Each commutating passage 118 is adapted to provide commutating fluid communication between the first and second pluralities of fluid passages 98, 100 of the valve member 88 and the corresponding volume chamber 64.
各整流通路１１８は、バルブ部材８８の第１流体通路９８及び第２流体通路１００と対応する容積室６４との間を整流流体接続するように構成される。

WO2016137887
[0002] The subject matter disclosed herein relates generally to compressors and compressor technology and, more specifically, to a device that conditions flow of working fluids at an inlet and/or outlet of a compressor.
【０００２】
  ここに開示した内容は、一般にコンプレッサー及びコンプレッサー技術に関し、更に詳細には、コンプレッサーの吸入口及び／又は吐出口で動作流体の整流を行う装置に関する。

US10576227
[0161] As shown in FIGS. 8 and 9, the bottom cover 124 includes a plurality of stator vanes or de-swirling vanes 129 , e.g., between about 2 and 50 stator vanes or about 15-30 or about 5-15, to direct airflow towards the outlet 125 , e.g., also referred to as flow straighteners. 
【００７１】
  図8および図9に示すように、底部カバー124は、たとえば整流装置とも呼ばれる、空気流を排気口125の方へ向けるための複数の固定子ベーンまたは非旋回ベーン129、たとえば約2個から50個の間の固定子ベーンまたは約15～30個もしくは約5個～15個の固定子ベーンを含む。

US10843787
[0002] A mounting pylon of each engine of an aircraft may couple the engine to the aircraft's wing.
【０００２】
  航空機の各エンジンの取り付けパイロン（ｍｏｕｎｔｉｎｇ  ｐｙｌｏｎ）は、エンジンを航空機の翼に連結し得る。

The pylon typically includes structural component (e.g., a strut) encased within a streamlining skin (e.g., a fairing).
パイロンは、通常、整流外板（例えば、フェアリング）内に包まれた構造部品（例えば、ストラット（支柱））を含む。

The mounting pylon may be proximate to hot exhaust from the engine.
取り付けパイロンは、エンジンからの熱排気に近接し得る。

In some cases, a heat shield may be provided over at least an area of the strut close to the hot exhaust to prevent heat degradation of the strut.
場合によっては、熱排気に近接するストラットの少なくとも一領域の上に遮熱部を設けて、ストラットの熱劣化を防止することができる。

残りの部分

US10186007
FIG. 4 illustrates a flowchart of operations 400 of another example embodiment consistent with the present disclosure. The operations provide a method for adaptive scheduling of task assignment among heterogeneous processor cores. At operation 410, a pool of work items is provided. The pool is shared by a plurality of central processing units (CPUs) and a graphics processing unit (GPU). At operation 420, a GPU proxy profiling thread is run on one of the CPUs to profile execution of a first portion of the work items on the GPU. At operation 430, a CPU profiling thread is run on each of the CPUs to profile execution of a second portion of the work items on each of the CPUs. At operation 440, a distribution ratio is calculated based on measured profiling information from the CPU profiling threads and from the GPU proxy profiling thread. At operation 450, a remaining portion of（＊残り全部ではなく、「ある特定の」残りの部分？）the work items from the pool is distributed between the CPUs and the GPU based on the distribution ratio.

According to Example 1 there is provided a system for workload scheduling. The system may include a plurality of central processing units (CPUs); a graphics processing unit (GPU); and a memory module configured to store a pool of work items, the pool shared by the CPUs and the GPU. The system of this example may also include a GPU proxy profiling module, associated with one of the CPUs, configured to profile execution of a first portion of the work items on the GPU. The system of this example may further include a plurality of CPU profiling modules, each associated with one of the CPUs, configured to profile execution of a second portion of the work items on each of the CPUs. The measured profiling information from the CPU profiling modules and from the GPU proxy profiling module is used to calculate a distribution ratio for execution of a remaining portion of the work items between the CPUs and the GPU.

...

Example 5 may include the subject matter of Examples 1-4, and the GPU proxy profiling module is further configured to distribute the remaining portion of the work items between the work-stealing queues and the GPU.

US20180046823
FIG. 25 is a diagram showing growth of a domain manager (VMMlet) in accordance with one embodiment of the invention. Growth of a domain manager (VMMlet) may be needed, for example, to include additional memory to load a remaining portion of the consumer's VM image after the consumer's domain launch image has been loaded and the domain manager (VMMlet) is executing. Once a secure domain manager (VMMlet) 2522 with consumer secret keys 2523 is running in a key domain 2550, the consumer can securely communicate the rest of（＊残り全部）the consumer's VM image 2532 to the domain manager (VMMlet) 2522. The rest of the consumer's VM image 2532 may include, for example, operating system(s), application(s), scripts, or other code.

From “Execute Consumer's Domain Launch Image and Verify Entry Point” block 616, control proceeds to “Load Rest of Consumer's Domain Image into Memory” block 618. The key domain-capable server loads remaining portions of the consumer's domain image into memory. The remaining portions of the consumer's domain image may include, for example, the rest of a domain image 2532 of FIG. 25, including operating system(s), application(s), scripts, or other code.

US8438504
[0008] In accordance with some embodiments, a method is performed at a multifunction device with a display and a touch-sensitive surface. The method includes displaying a first viewing area. The first viewing area includes a first plurality of selectable objects. The method also includes: detecting activation of an object in the first plurality of selectable objects; and, in response to detecting activation of the object in the first plurality of selectable objects, overlaying a second viewing area on a portion of the first viewing area while maintaining display of a remaining portion of the first viewing area. The second viewing area includes a second plurality of selectable objects. The method also includes: detecting activation of an object in the second plurality of selectable objects; and, in response to detecting activation of the object in the second plurality of selectable objects, overlaying a third viewing area on a portion of the first viewing area. The third viewing area includes a third plurality of selectable objects. The method further includes, in response to detecting activation of the object in the second plurality of selectable objects: displaying a portion of the second viewing area overlaid on a portion of the first viewing area; and maintaining display of a remaining portion of the first viewing area.

[0190] FIGS. 5F-5H illustrate overlaying third viewing area 552 - 2 over a portion of first viewing area 520 . Third viewing area 552 - 2 slides in from the right edge of touch screen 112 . While third viewing area 552 - 2 slides in, second viewing area 552 - 1 slides to the left edge of touch screen 112 . The display of a remaining portion of（＊なぜ定冠詞でないのか謎。領域520のうち552－1と552－2以外の部分だから唯一特定のはず）first viewing area 520 is maintained.

これらの；タイトル

WO2019224096
HETEROCONDENSED PYRIDONES COMPOUNDS AND THEIR USE AS IDH INHIBITORS
複素縮合ピリドン化合物及びＩＤＨ阻害剤としてのこれらの使用

US2021043903
MICROPOROUS MEMBRANES, BATTERY SEPARATORS, AND METHODS FOR MAKING AND USING THE SAME
微多孔膜、バッテリーセパレータ、及びこれらの製造方法、デバイス及び多層微多孔膜

WO2016114770
WIRELESS TERMINALS, NODES OF WIRELESS COMMUNICATION NETWORKS, AND METHODS OF OPERATING THE SAME
無線端末、無線通信ネットワークのノード、及びこれらの運用方法

US2019127280
NANOPOWDERS, NANOCERAMIC MATERIALS AND METHODS OF MAKING AND USE THEREOF
ナノ粉末、ナノセラミック材料並びにこれらの製造方法及び使用方法

EP3406438
COMPOSITE CORE, COMPOSITE STRUCTURE ASSEMBLY, AND METHOD FOR FORMING THE SAME
複合コア、複合構造アセンブリ、およびこれらの形成方法

重なる位置に

EP3684294
[0084] As the plunger 340 continues to move the IOL 10 along the longitudinal axis and die shuttle lumen 102,
【００６２】
  プランジャ３４０が長手方向軸線およびシャトル内部空間１０２に沿ってＩＯＬ１０を移動させ続けるときに、

the optic 16 of the IOL 10 continues to deform or bend in the direction imparted by the transition of the shuttle 100 from the storage configuration to the loading configuration,
ＩＯＬ１０の光学部１６は、保管形態から装填形態へのシャトル１００の移行によって付与される方向に変形し続け、または曲がり続け、

and each of the leading and trailing haptics 12, 14 moves up along the respective haptic ramps 132, 172 to dispose a majority of each haptic in an overlying position with respect to the optic.
前縁および後縁の支持部１２，１４はそれぞれ、それぞれの支持部用傾斜路１３２，１７２に沿って上がって、各支持部の大部分を光学部に重なる位置に配置する。

US10839999
 As shown in the embodiment of FIG. 11, the base 174 - 1 is located axially adjacent to the coil winding 72 , and outward of the coil bearing 50 , at a location that overlaps the coil winding 72 in the radial direction.
図１１の実施例に示すように、ベース１７４－１は、コイル巻線７２に軸方向に隣接し、コイル軸受５０の外側で、コイル巻線７２と半径方向に重なる位置に配置される。

In further embodiments, the base 174 - 1 can be integrally and monolithically formed with the bobbin 101 , or could be supported on (e.g., overmolded on) the second pole 170 - 2 or another suitable supporting structure.
さらなる実施形態では、ベース１７４－１は、ボビン１００と一体的かつ堅固に形成することができ、又は第２の磁極１７０－２又は別の適切な支持構造上に支持（例えば、オーバーモールド）することができる。

US9906867
The top shunt plate may be juxtaposed to a distal end of the primary assembly, and between the magnet and the primary assembly.
上部シャントプレートは、磁石と一次組立体との間において一次組立体の遠位端に並置してよい。

More specifically, a top shunt plate may be disposed substantially within an interior of the voice coil former,
より具体的には、上部シャントプレートは、ボイスコイル形成器の略内部に配置してよく、

and the voice coil wire may be wound external to the voice coil former at a portion thereof,
またボイスコイルワイヤを、ボイスコイル形成器の一部分において、ボイスコイル形成器の外側に巻くことにより、

such as to be disposed in a substantially overlying position relative to an external edge of the top shunt plate. 
上部シャントプレートの外縁部に対して略重なる位置に配置してよい。

WO2016162071
[0068] In Fig. 9b, substrates 500 are coupled to the sub-carriers 400, which are coupled to the main carrier 100.
【００６８】
  図９ｂでは、基板５００は、メインキャリア１００に連結されているサブキャリア４００に連結されている。

The substrates 500 are located in a position, where the substrates 500 overlap the openings 422 of the sub-carrier.
基板５００は、基板５００がサブキャリアの開口部４２２と重なる位置に配置されている。

The openings 422 of the sub-carriers being overlapped by the substrates 500 are shown in dashed lines.
基板５００が重なるサブキャリアの開口部４２２は、破線で示されている。

As can be seen in the embodiment of Fig. 9b, the substrates are at a position, where the substrates overlap with the openings 422 of the sub-carriers 400 as well as with the openings 122 of the main carrier 100. 
図９ｂの実施形態で見ることができるように、基板は、基板がサブキャリア４００の開口部４２２及びメインキャリア１００の開口部１２２と重なる位置にある。

現在形で未来、状態と動作、構造と機能・目的

基板に接続される端子（未来の話；現在は接続されておらず、使用時に基板に接続される（ように構成、設計されている；するための））

（すべて仮説）

1) A terminal connected to a substrate. (NG)

2) A terminal to be connected to a substrate. (OK)

3) A terminal which/that is connected to a substrate. (NG)

4) A terminal, which is connected to a substrate. (NG)

5) A terminal which/that connects to a substrate. (OK；動作、機能)

6) A terminal, which connects to a substrate. (OK)

7) A terminal for connection to/with a substrate. (OK)

8) A terminal which/that will be connected to a substrate. (OKだが長い）

 

US9629075
Referring now to FIG. 4, a flow diagram of a method to implement a mobile device handoff using distributed mobility anchor functionality in accordance with one or more embodiments will be discussed. Although FIG. 4 shows one particular order of the blocks of method 400, various other orders of blocks may be provided, with more or fewer blocks, in other embodiments, and the scope of the claimed subject matter is not limited in these respects. At block 410 a mobility anchor is assigned to be the mobility anchor of a mobile device that connects to the network via a base station that is connected to that mobility anchor. 

US10261370
Conductive paths such as conductive bridges 56 that connect display circuitry with other circuitry in electronic device 10 may have one end that bonds with a contact on the surface of the TFT layer and another end that bonds with a contact on the surface of a printed circuit within the device. In the example shown in FIG. 3, conductive bridge 56 may have one end that bonds with contact pad 54A (on the surface of TFT layer 14B) and another end that bonds with contact pad 54B (on the surface of printed circuit 58).

＊しかしこの図３の例では「接合された状態」を自動詞bondで表している。それでいいのか？状態の説明なんだから(that is) bonded withの方が良くないか？

US5745624
In accordance with other aspects of this invention, the resistor is a thin metallic film resistor formed of a material that bonds with（＊接合する；可能性）solder. The thin metallic film resistor overlies the substrate and generates heat when electrical current is applied. As a result, this resistor is called a resistor/heater. Solder placed on the resistor/heater becomes molten when the resistor/heater reaches the solder's melting temperature. When this occurs, a chemical bond is formed with the metallic resistor/heater.

US7012011
The polycrystalline CVDD layer 260 is grown on the graphite substrate 270 with a matched CTE. The thickness of the polycrystalline CVDD layer 260 may be approximately 250 μm. As is known by one skilled in the art, other thicknesses for the CVDD layer 260 may also be used. After growing, the polycrystalline CVDD layer 260 is cleaved from the graphite substrate 270. Metallization on the flat side of the CVDD layer 260 is performed to provide the flat side metal layer 280 for bonding to（＊接合するための；形容詞）the backside metal layer 230 of the silicon wafer 200 shown in FIG. 2A. 

US9685689
For instance, in some embodiments, the sacrificial metal layer comprises at least one metal layer that adheres to the working substrate. Moreover, in some embodiments, the sacrificial metal layer comprises at least one metal layer that bonds to（＊状態？機能？）the first bio-compatible layer. Further, in some embodiments, removing the sacrificial metal layer to release the bio-compatible device from the working substrate comprises dissolving the sacrificial metal layer in a fluid. The fluid may be the same as or similar to the fluid used to dissolve the sacrificial metal layer 304 described with reference to FIG. 3 q.

US20160181476
 The array of micro LEDs 150 is then positioned over a receiving substrate 300 as illustrated in FIG. 17. In an embodiment the receiving substrate 300 is a display substrate. For example, the receiving substrate 300 may include an array of driver contacts 302, and optionally an array of bank structures 310 within subpixel areas. A solder material pillar 304 may be formed on each driver contact 302 for bonding with（＊接合するために；副詞）an LED 150.