大容量の次世代メモリー 日米韓、一斉生産へ 東芝やサムスン 市況回復で春以降 携帯情報端末の小型化促す
According to sources, major IC makers in the U.S.,Japan and South Korea likely start to mass-produce so-clled next-generation,ultra-large scale memory chips beginning this spring together.
South Korean Samsun,the first-ranked maker, and the second-running Toshiba will participate in this movement. This comes after the market condition has recovered for such makers, and other manufactures also likely follow the suit.
This mass-production of cutting-edge IC chips will lead to further downsizing of mobile information terminals like cellular phones or mobile PCs.
According to sources, major IC makers in the U.S.,Japan and South Korea likely start to mass-produce so-clled next-generation,ultra-large scale memory chips beginning this spring together.
South Korean Samsun,the first-ranked maker, and the second-running Toshiba will participate in this movement. This comes after the market condition has recovered for such makers, and other manufactures also likely follow the suit.
This mass-production of cutting-edge IC chips will lead to further downsizing of mobile information terminals like cellular phones or mobile PCs.
